Tuesday, 12 June 2018
Joint Panel Session with RFIC: Can a residential wireless Gbps internet connection compete with wired alternatives?
Location: Room 201A
Organizers: Amin Arbabian, Stanford Univ.; Dalma Novak, Pharad, LLC.; Oren Eliezer, PHAZR; Rod Waterhouse, Pharad, LLC.
Abstract: The demand for Internet bandwidth continues to grow rapidly; Nielsen’s Law of Internet Bandwidth states that a user’s connection speed grows by 50% per year. While we all may want a faster Internet connection, most people are unwilling to pay more to get higher data rates. Gigabit-per-second (Gbps) residential internet connections have typically been supported by well-established high-speed wired networks. However, there are a number of emerging technologies that offer the potential to compete directly with these approaches. In this session, expert panelists will discuss some of the technology advancements that are enabling Gbps internet connections and will debate the merits of both the wired and wireless technology alternatives.
1. John Cioffi, Chief Executive Officer, ASSIA Inc. and Professor Emeritus at Stanford University
2. Oleh Krutko, Director of Engineering, Head of Millimeter Wave, Broadband, and Power Product Development, IDP Business Group, Qorvo
3. Mike Geen, Head of Engineering, Filtronic Broadband 4
Pat Iannone, Member of Technical Staff, Nokia/Bell Labs
5. Wilhelmus Theunissen, Facebook Connectivity Labs
Wednesday, 13 June 2018
Body Wearable Technology: is it still relevant and what is its future?
Location: Room 201A
Organizers: Dalma Novak, Pharad, LLC.; Rod Waterhouse, Pharad, LLC.
Abstract: Body wearable technology has been incorporated into a vast range of industries/applications; whether to improve the mobility and situational awareness of a modern-day soldier, monitor the physical exertion of an elite athlete, or simply to change the color of a piece of clothing to suit the mood of the person wearing it. While there have been many successful applications of wearable technology and significant adoption within our society, there have also been some notable failures (Google glass?). In some cases it could be argued that the technology is more of a solution looking for a problem. In this session we will have expert panelists from a variety of backgrounds (industry, academia and military) share their view on this topic, as well as debate the usefulness and future direction of body wearable technologies.
1. Gerard Hayes, Wireless Research Center of North Carolina
2. Karu Esselle, Macquarie Univ.
3. Manos Tentzeris, Georgia Institute of Technology
4. Mitchell Mayer, Army Cerdec
5. Preet Sibia, Infineon Technologies 6. Roger Antunez, First Vision
5G PA/FEM: Si or III-V - who will win the race?
Location: Room 201A
Organizers: Kamal Samanta, Sony Europe, UK
Abstract: 5G is proposed as the next major revolution of wireless communications, where mm-W FEMs will be delivering wide-band power, yet within highly reduced size and cost. This requires innovative solutions in semiconductor/device technology and circuit topologies. Traditionally, state-of-the-art FEMs are implemented on III-V (GaAs/GaN) due to their demanding performance requirements (power/bandwidth/efficiency). However, Si devices are very attractive due to their maturity and ability to integrate complex digital and RF/analog circuitry cost-effectively. Recently, Si has been overcoming the high-frequency barrier, while GaN/SOI is maintaining performance at a low cost and operating voltages. Both Si and III-V technologies will be represented with panelists from leading foundries/industries. The panel will review state-of-the-art industrial developments in Si (SiGe/BiCMOS and SOI/CMOS) and III-V (GaN/SOI/ SiC and GaAs) devices; compare their performance; and discuss the future trends and challenges for 5G deployment. The panel will also debate critical issues such as the use of the right technology/process (Si or III-V) and beamforming topology (all-digital mass-MIMO, RF or hybrid) for 5G FEMs.
1. Bror Peterson, Qorvo
2. Christophe Auvinet, UMS, France
3. Joy Laskar, MAJA Systems
4. Kamal Samanta, Sony Europe, UK
5. Marc Rocchi, OMMIC, France
6. Sushil Kumar, Global Foundries